Post on 18-Oct-2020
www.pactech.de
PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA
PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia
PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany
Contact us at sales@pactech.de
LAPLACE-CapHigh Accuracy Automatic Laser Bonder
for Capacitor Bonding on Wafer Probe Cards
Specification:
Capacitor Bonding and Laser Reflow for High Density Applicationswith Very Fine Component to Component Distances on SpecialSubstrates Like e.g. Wafer Probe Cards
• Capacitor feeder• Pick and place tool with 1µm resolution• Max. capacitor size: 1.25mm x 2.0mm
• Heating system with temperature controlling
• Patented laser thermode tool• Bonding direction is 180°• Requires only a thin layer of solder on the
• No additional reflow process needed• Max. working area: 325mm x 325mm• Placement accuracy: +/- 10µm• Throughput: 500 capacitors per hour
(upgradable to max.: 2.5mm x 2.5mm)
(Max. temp.: 150°C, temp. range: +/- 3°C)
(including soldering)
substrate/component pad