API IR Presentation 11-16-06[1]

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    Investor Relations Presentation

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    Forward Looking Statement

    This presentation contains forward-looking statements.All forward-looking statements involve risks anduncertainties, including, without limitation, the risksdetailed in the Companys filings and reports with the

    Securities and Exchange Commission. Such statementsare only predictions, and actual events or results maydiffer materially from those projected.

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    Significant Milestones

    Sep. 1989: Acquired Silicon Detector Corp. Mar. 2000: New board appointed

    July 2002: Acquired Silicon Sensors LLC

    Feb. 2003: Acquired Texas Optoelectronics, Inc.

    Mar. 2004: Completed 1st year of profitability

    Oct. 2004: Secured $5M in convertible debt

    Dec. 2004: Acquired Photonic Detectors, Inc.

    Mar. 2005: Completed 2nd year of profitability

    May 2005: Acquired Picometrix, Inc

    March 2006 Second $5M in Convertible debt

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    API Overview

    Custom OptoelectronicSolutions

    Photodiodes: Silicon and InGaAs LED assemblies

    High-Speed OpticalReceivers

    Terahertz Systems

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    Growth Drivers

    Custom Optoelectronic Solutions Defense & homeland security

    Medical

    Optical Receivers Telecom 10 Gb/s & 40 Gb/s

    Defense

    Terahertz

    Non-destructive testing (NDT)

    Defense & homeland security

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    Core Competencies

    Vertical integration from wafer fabrication tofinished device, subsystem or system

    Components

    Subsystems

    Systems

    Wafer

    Fabrication

    Component

    PackagingMaterial Growth

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    Global Markets Served

    Homeland

    Security

    NDT

    Telecom/IT

    Military

    Medical

    Industrial

    Current Emerging

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    Sales by Market

    Q1 FY06 % Q1 FY07 % Q2 FY06 Q2 FY06 Q2 FY07 Q2 FY07 FY07 YTD FY07 YTD

    TELECOMMUNICATIONS 504,717 9.9% 743,385 13.1% 920,000$ 17.8% 1,761,000$ 30.0% 2,504,385 21.7%

    INDUSTRIAL SENSING/NDT 2,163,451 42.6% 2,411,732 42.5% 2,049,000$ 39.6% 2,403,000$ 40.9% 4,814,732 41.7%

    MILITARY/AEROSPACE 1,213,466 23.9% 1,868,532 33.0% 1,225,000$ 23.7% 1,138,000$ 19.4% 3,006,532 26.0%

    MEDICAL 697,498 13.7% 633,891 11.2% 446,000$ 8.6% 481,000$ 8.2% 1,114,891 9.7%

    HOME LAND SECURITY 498,295 9.8% 10,748 0.2% 533,000$ 10.3% 95,000$ 1.6% 105,748 0.9%

    TOTAL 5,077,427 100.0% 5,668,288 100.0% 5,173,000$ 100% 5,878,000$ 100% 11,546,288 100%

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    Custom Optoelectronic Solutions

    Specializing in the design and fabricationof Silicon and InGaAs detectors

    Custom solutions optimized for customerapplications

    Supplying assemblies and subsystems

    Serviceable market size: $250M

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    Custom Optoelectronic Solutions

    growth opportunities

    Military Market

    Smart munitions

    Developing Sensor Technology

    High Reliability Medical Applications High sensitivity photodiodes (APDs)

    Custom packaging and hybridization

    Improving gross margins through consolidationmature stage 3

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    Military Market Focus

    APPLICATIONS Satellite PositioningLaser range finders

    Missile guidance

    Heads-up displaysOptical proximity fuse

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    API Products Medical Market

    Hybrid Assembly used in

    bacteriology system

    LED Array

    9 Element Pd Array

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    Key Customers for Custom

    Optoelectronic Solutions

    http://www.raytheon.com/static/node2634.html
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    High-Speed Optical Receivers

    (HSOR)

    Uses for HSOR:

    10 & 40Gb/s receiver fiber optic transmission

    (OEM Line Cards, Transponders, and Routers)

    High performance, market leading T&M equipment

    (Data analyzers, oscilloscopes, BER testers, network analyzers)

    Munitions and guidance systems

    (Defense Towed Decoy, SATCOM, Communication)

    Entering stage 3 with sales and marketing build up

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    HSOR Features/Value Proposition

    Best performance PIN and APD Photodiodes Highest Speeds

    Top in class in sensitivity

    Most stable over temperature

    Vertically integrated to optimize receiver solutions forcustomers (packaging & amplification) using standard

    semiconductor PIN & APD

    Ability to develop new PIN & APD semiconductors,

    based off of patented standard products

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    Telecommunication Product Chain

    OEM Transmission

    (Cisco, Alcatel, Siemens,etc.)

    Test &

    Measurement(R&D and QC)

    TransponderMfg.

    Service Providers (Carriers)(over 100 e.g. AT&T, Verizon, BT, Deutsche Telekom, etc.)

    Component Mfg. (API)

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    Telecom Infra-structure

    BusinessEnterprise

    Metro Core

    New YorkSan Francisco

    ConsumerEnterprise

    Triple Play Voice, Data& HDTV

    Metro Access BusinessEnterprise

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    10Gb/s &40Gb/s Equipment OEMs

    !"#$%&'()*+(,-&) .(/-&('0$12(-$3'&,$4-)25( 12(-$)2,-$%&'()*+(,-&)

    6"7$8999:#7;""$99

    3+&-"/&-'?$;5202/@ 1'?A,'B/&-?-C

    DEFE1G$

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    What is Terahertz?

    Terahertz is the last underutilized frontier of the EM Spectrum.

    Advances in femtosecond lasers and fiber optic coupled packagedsemiconductor devices have enabled practical T-Ray instrumentation.

    Beginning of Stage 2, market and product development

    TH U i C bi i

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    THz Unique Combination

    of Properties

    Image through material (like X-ray and better than microwaves) Spatial resolution similar to that of the human eye (~100 um)

    Precise depth resolution (~5 um)

    Non-invasive chemical composition or spectroscopic

    features of hidden objects Better than X-ray Microwaves cannot

    Better than chemical sensors which are invasive

    Safe, not harmful to operators or inspected material

    (unlike X-rays)

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    T-Ray Applications

    Application R&D Homeland Security and defense People/Packages

    for concealed weapons including Weapons

    Explosives

    Biological

    Chemical

    Manufacturing Non-Destructive Quality Control Automotive/Aerospace

    Food and consumer products Pharmaceuticals

    Petrochemical

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    Terahertz Markets

    Non-Destructive Testing (NDT) Applications include industrial quality control, process

    monitoring

    World process control market > $75B in 2002*

    API estimates THz sensors for NDT > $300M/year

    Markets application include moisture, corrosive,voids, bond strength measurements and chemicalcomposition (both existence and distribution).

    *Source: Robert W. Baird & Co

    **Source: Morgan Keegan & Company, Inc.

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    Market analysis

    (Beta gauge replacement)

    Applications: mass (thickness, density, basisweight, particulate matter)

    Radioactive: Licensed, Problems with loss,

    disposal, monitoring $124,604K sold in 2005 (4153 units)

    $137,951K sold in 2004 (4598 units)

    If we reach 5% market penetration; $20M market (200 units / yr)

    Data from Census Bureau report ma334t05

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    Chemical Plant Inspection

    21,000 Chemical plants on Chinas rivers

    15,000 Chemical plants in the U.S.

    If 2% needed 2 imaging systems for corrosion

    under insulation Total Addressable Market: $120M (in US)

    If we get 10% per year

    $12M per year (60 units / yr)

    Non Destructive Quality

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    Non Destructive Quality

    Control Scanning

    Corrosion

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    Aerospace Market

    NASA Return to Flight Program

    Columbia Advisory InvestigationBoard (CAIB) required improvedNDT inspection of critical parts

    Main culprit: Voids in foam

    insulation on external fuel tank Picometrix THz solution selected

    above other methods duringtechnology discovery phase

    1.25 mm resolution 300 x 600 mm 4x faster than other techniques

    O li NDE

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    On-line NDE:

    PharmaceuticalProduce Drug

    (API)

    Reaction

    Monitor

    !!!!

    Crystallization

    Crystallization

    Monitor

    Drying

    Drying, Head

    Space Monitor

    Granulation

    Particle Size, Coating

    Level

    Blending

    Blend

    Uniformity

    Pfizer

    Tableting

    Uniformity,

    Hardness, Coating,

    etc.

    Milling

    NDE Ph l M k

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    NDE in Pharmaceutical MarketDetermining Tablet Inconsistencies of Active Ingredient

    Tablet 1 Tablet 2 Tablet 3 Tablet 4 Tablet 5

    Batch 1

    Batch 2

    Batch 3

    Images provided by leading pharmaceutical manufacturer

    TH H l d S i A li i

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    THz Homeland Security Application:

    Security Screening Market

    Development Programs Airport baggage screening in conjunction

    with L-3 for TSAs Manhattan II program

    Personnel screening

    Remote explosive detection Portal screening

    Sheet explosive

    Gun

    Knife

    Block Explosive

    Development feasibility study of

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    Development feasibility study of

    personnel scanning

    Remote explosive detection Portal screening

    Program Management Model for

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    Program Management Model for

    Technology Readiness Level

    THz is level TRL 5

    for DHS and DoD

    P d F

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    Patented Features

    Fiber optic coupled sensors are small and freelypositionable up to 30 m

    Single sensor can measure multiple parameters

    Ruggedized compact form factor

    Robust, permanent alignment

    Multiple sensors possible

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    C lid I S

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    Consolidate Income StatementSeptember 29,

    2006

    September 25,

    2005

    September 29,

    2006

    September 25,

    2005

    Total Revenues 5,877,776$ 5,193,466$ 11,546,065$ 10,270,892$

    Total Cost of Sales 2,997,150 3,077,141 6,188,710 5,999,248

    Gross Margin 2,880,626 2,116,325 5,357,354 4,271,64449.0% 40.7% 46.4% 41.6%

    Other Operating Expenses

    Research & Development 1,018,987 802,406 1,987,903 1,246,564

    General & Administrative 1,900,319 1,455,451 3,579,769 2,809,272

    Sales & Marketing 452,231 506,229 983,565 829,332

    Total Other Operating Expenses 3,371,537 2,764,086 6,551,237 4,885,168

    Net Operating Loss (490,911) (647,761) (1,193,883) (613,524)

    Other (Income) & Expense

    Other (Income)/Expense (5,411) (138) (4,540) 6,994

    Interest Income (58,702) (5,084) (116,413) (14,697)

    Other Expense - Wafer Fab 88,344 - 120,897 -

    Interest Expense-Related Party 54,899 51,196 111,870 100,177

    Interest Expense - Warrant discount 345,899 789,859 640,360 891,173

    Interest Expense 207,655 139,770 411,148 262,203

    Other (Income)/Expense 632,684 975,603 1,163,322 1,245,850

    Net Loss (1,123,595)$ (1,623,364)$ (2,357,205)$ (1,859,374)$

    Net earnings per share (0.06)$ (0.09)$ (0.12)$ (0.11)$Diluted earnings per share anti-dilutive anti-dilutive anti-dilutive anti-dilutive

    Weighted Number of shares outstanding 19,026,000 17,252,000 19,003,000 16,192,000

    Fully diluted number of shares outstanding 22,479,710 19,783,000 22,456,822 18,723,000

    Three Months ended Six Months Ended

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    Consolidate Proforma

    September 29, 2006 September 25, 2005 September 29, 2006 September 25, 2005

    Net Income (Loss) (1,124,000)$ (1,624,000)$ (2,357,000)$ (1,859,000)$

    Add Back:

    Interest Expense - Convertible notes 129,000 59,000 249,000 179,000

    Interest expense - Warrant (Fair Value) 346,000 790,000 640,000 891,000

    Amortization - prepaid finance expense 33,000 57,000 66,000 120,000

    Amortization - PICO intangibles/patents 349,000 319,000 698,000 497,000Stock Option Compensation Expense 66,000 - 183,000 -Other Expense - Wafer Fabrication 88,000 - 121,000 -

    Subtotal - Add backs 1,011,000 1,225,000 1,957,000 1,687,000Pro Forma Net Income (113,000)$ (399,000)$ (400,000)$ (172,000)$

    Net earnings per share (0.01)$ (0.02)$ (0.02)$ (0.01)$

    Diluted earnings per share anti dilutive anti dilutive anti dilutive anti dilutive

    Weighted Number of shares outstanding 19,026,000 17,252,000 19,003,000 16,192,000

    Fully diluted number of shares outstanding 22,479,710 19,783,000 22,456,822 18,723,000

    Six months endedThree months ended

    l d d

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    Consolidated EBITDA

    September 29, 2006 September 25, 2005 September 29, 2006 September 25, 2005

    Net Income (Loss) (1,124,000)$ (1,624,000)$ (2,357,000)$ (1,859,000)$

    Add Back:Net Interest expense (income) 204,000 186,000 407,000 348,000

    Interest expense - Warrant (Fair Value) 346,000 790,000 640,000 891,000Depreciation Expense 241,000 207,000 478,000 365,000Amortization - Intangibles/patents 382,000 360,000 763,000 593,000Amortization - prepaid finance expense 33,000 57,000 66,000 120,000

    Subtotal - Add backs 1,206,000 1,600,000 2,354,000 2,317,000EBITDA 82,000$ (24,000)$ (3,000)$ 458,000$

    Three months ended Six months ended

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    Gross Margin Percent

    0%

    5%

    10%

    15%

    20%

    25%

    30%

    35%

    40%

    45%

    50%

    FY2004 FY2005 FY2006 FY2007 YTD

    Gross Margin

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    Thank you

    Richard Kurtz, CEO & [email protected]

    Robin Risser, [email protected]

    AMEX Symbol: API

    www.advancedphotonix.com